Welcome:Beijing Plink Ai Technology Co.,LTD.Service Hotline:+86-400-127-3302
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Introduction
The AI310SM is a high-performance industrial-grade edge AI inference module based on the Ascend 310P processor, capable of providing up to 176 TOPS INT8 computing performance.
It not only uses high-reliability industrial-grade materials and strictly follows the JESD-046 standard, but also ensures long-term stable supply through the PCN notification mechanism, providing reliable protection for demanding industrial environments. At the same time, it supports HCCS dual-module high-speed interconnection technology with a total bandwidth of 192 Gbps, laying a solid foundation for building high-performance edge computing clusters.
Specifications
| Processor | Ascend 310P |
| AI Compute | 176 TOPS INT8 |
| CPU | ARMv8.2 16core TaishanV200M@max. 1.9 GHz |
| Memory | 48 GB 256bit LPDDR4X |
| Storage | 128G EMMC |
| Encode/Decode |
Video Encode: 24x 1080P@30fps/3x4K@60fps H.264/H.265 Video Decode:96x 1080P@30fps/12x4K@60fps H.264/H.265 JPEG Encode: 4K@192fps (FHD@1024fps)
JPEG Decode: 4K@384fps (FHD@2048fps) |
| High-Speed Interface |
Serdes: 可復(fù)用為XGE，PCIe，SATA，HCCS接口 XGE: 最大支持8個XGE Serdes 接口，速率支持 10.3125/5/2.5Gbps PCIe: 最大支持1個PCIe Gen4 16X接口，兼容1X，2X，4X，8X |
| Other I/O |
SATA: 支持4個SATA3.0 CAN-FD: 支持4路隔離CAN-FD UART：支持4路三線制 I2C：支持4路I2C SPI：4路SPI MDIO：支持2組MDIO PWM：支持4路PMW GPIO：支持8路可編程GPIO |
| Power | ≤120W |
| Dimensions |
140mm*80mm*17mm |
| Weight | ≤0.5kg |
| Input Voltage |
12V DC |
| Operating Temperature |
-40℃~ +65℃ |
| OS | 銀河麒麟（EP）/OpenEuler（RC） |
Dimensions
